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Wafer handling
Materials and solutions for Wafer handling

Materials and solutions for Wafer handling

A typical semiconductor factory (fab) includes hundreds of machines that perform a variety of processes for wafer production. Processes include deposition, material removal, patterning, modification of electrical properties, and more.  A common element across all these machines is the need for wafer handling tools. These tools include wafer picks/wands, cassettes, FOUPs, grip effectors and automated or robot wafer handlers.

Material properties for Wafer handling:

Typical plastic materials used

  • PEEK reinforced
    excellent fatigue and chemical resistance
  • PEI
    high strength and stiffness with good chemical resistance
  • PVDF
    corrosion, acid and alkali resistant
  • Polyimide
    excellent high temperature properties
     

Röchling materials for Wafer handling

Arrange technical advice

The performance and service life of plastics for use in the semiconductor industry are influenced by a variety of factors. These criteria need to be considered in order to make the right choice in materials. Examples:

We are happy to advise you on the selection of suitable materials for your particular application. Just use our contact form at the bottom of the page.

 
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