A good example to show the precision of our machining are Durostone® PCB solder pallets. They are used to fix electronic components on printed circuit boads using the wave soldering process. The design of the solder pallets is exactly adjusted to the design of the printed circute board.
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Durostone® PCB solder pallets
Durostone® PCB Solder Pallet Materials
Durostone® materials have been engineered for all stages of the PCB assembly process. Two primary grades, Durostone® CAS761 and CAG762 are specifically designed foruse in both SMT reflow and wave soldering applications.
These materials provide the following advantages:
- Outstanding mechanical properties at elevated temperatures during wave soldering and SMT reflow.
- Low thermal conductivity, ensuring stable performance under heat stress.
- Excellent machinability, enabling the production of complex and precise solder pallet designs.
- High chemical resistance, offering durability against modern flux formulations.
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Durostone® Solder pallets
Harsh environments
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Durostone® Solder pallets - perfectly machined
In the wave soldering process, combined effects of flux, temperature and process cycle time can shorten the lifespan of standard solder pallet materials. Durostone® WGR-X offers the solution – a woven glass laminate engineered to withstand extreme temperatures and aggressive fluxes. Fluxes containing halides or halogen activators typically degrade materials over time, but
Durostone® WGR-X is designed for very high cycle repetition. Its woven glass reinforcement prevents flux penetration, protecting the pallet surface and fibre.
The resin formulation enables continuous operation at 280 °C, delivering excellent mechanical strength and dimensional stability under elevated temperatures. Thanks to the enhanced properties, titanium inserts can often be omitted depending on application requirements. Durostone® WGR-X also provides outstanding machining performance, allowing for precise fabrication even with thin wall sections.
