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Materials for High and Low temperature
Plastic solutions for thermic critical applications

Materials and solutions for thermic critical applications

Do you have applications in which very high or very low temperatures occur, such as when generating plasma? The construction materials you use may only have low thermal expansion, so dimensional stability over large temperature differences is very important to you. Do the mechanical characteristics also need to be maintained over a wide temperature range? If you have these and other requirements in combination, such as chemical resistance or purity, then Röchling's plastics are ideal for your application.

Material properties for High and Low temperature:

Typical plastic materials used

  • Polyimide
    premium material for high precision and highest temperature resistance
  • PEEK Ceramic
    is a premium material for high precisions
  • PEEK CF30
    reinforced polymer with excellent fatigue and chemical resistance
  • PEEK CT200
    special developed for cryogenic temperatures
  • PEEK
    excellent chemical resistance and high temperature resistance
  • PPS
    is a very resistant polymer with good mechanical strength and rigidity
  • PEI
    high strength and stiffness with good chemical resistance
  • EP
    highest mechanical properties and very low tehermal expansion
  • UP
    very good dimensional stability and high mechanical properties

Röchling materials for High and Low temperature

Arrange technical advice

The performance and service life of plastics for use in the semiconductor industry are influenced by a variety of factors. These criteria need to be considered in order to make the right choice in materials. Examples:

We are happy to advise you on the selection of suitable materials for your particular application. Just use our contact form at the bottom of the page.


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