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Chemical Mechanical Planarization (CMP)
Materials and solutions for CMP

Materials and solutions for Chemical Mechanical Planarization (CMP)

CMP is a method to produce a polished and flat wafer surface. This is necessary since after deposition of materials, the wafer surface is uneven.  For subsequent layers, the surface must be planar.  The technique involves attaching the wafer with a plastic retaning ring to a metal jig that brings the wafer in contact with an abrasive pad containing a slurry.  The pad rotates and with physical and chemical force, the wafer is modified.  See the picture below of a simplied CMP process.

Material properties

For CMP, plastics are used for the retainer ring and requirements are:

Typical plastic materials used

  • PEEK
    has low wear rate and excellent chemical resistivity within high temperature resistance
  • PET
    good wear resistance at moderate temperatures
  • PPS
    high abrasion and wear resistance

Röchling materials for CMP

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    The performance and service life of plastics for use in the semiconductor industry are influenced by a variety of factors. These criteria need to be considered in order to make the right choice in materials. Examples:

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