EtroX® V - ASTM
PEEK
Industries
Semiconductor CMP- Semiconductor High and low temperature
- Semiconductor Back-End applications
Technical Specifications EtroX® V - ASTM
| Test Method | Unit | Guideline Value | |
|---|---|---|---|
| Moisture | ASTM D6980 | % | 0.11 |
| Test Method | Unit | Guideline Value | |
|---|---|---|---|
| Tensile Strength | ASTM D638 | psi | 14320 |
| Tensile Modulus | ASTM D638 | ksi | 765 |
| Elongation at Break | ASTM D638 | % | 3.5 |
| Flexural Strength | ASTM D790 | psi | 23214 |
| Flexural Modulus | ASTM D790 | ksi | 791 |
| Test Method | Unit | Guideline Value | |
|---|---|---|---|
| Heat Deflection Temperature | ASTM D648 @ 264psi and 2C/min | °C | >205 |
