EtroX® V natural
PEEK
natural
sheetrod
Characteristics
- Buena maquinabilidad
- Low burring
- Baja absorción de humedad
- Buena estabilidad dimensional
Industries
Semiconductor Front-End applications- Semiconductor Back-End applications
- Semiconductor High and low temperature
Variants
Technical Specifications EtroX® V natural
| Test Method | Unit | Guideline Value | |
|---|---|---|---|
| Density | DIN EN ISO 1183-1 | g / cm3 | 1,62 |
| Water absorption | DIN EN ISO 62 | % | 0,15 |
| Test Method | Unit | Guideline Value | |
|---|---|---|---|
| Yield stress | DIN EN ISO 527 | MPa | 105 |
| Elongation at break | DIN EN ISO 527 | % | 2,5 |
| Tensile modulus of elasticity | DIN EN ISO 527 | MPa | 5300 |
| Notched impact strength | ISO 179-1/1eA | kJ / m2 | 1,0 |
| Shore hardness | DIN EN ISO 868 | scale D | 88 |
| Ball indentation hardness | DIN EN ISO 2039-1 | MPa | 275 |
| Test Method | Unit | Guideline Value | |
|---|---|---|---|
| Melting temperature | ISO 11357-3 | °C | 341 |
| Thermal conductivity | ISO 22007-4 | W / (m * K) | 0,44 |
| Service temperature, long term | Average | °C | -30 … 250 |
| Service temperature, short term (max.) | Average | °C | 310 |
| Test Method | Unit | Guideline Value | |
|---|---|---|---|
| Volume resistivity | DIN EN 62631-3-1 | Ω * cm | >1012 |
| Surface resistivity | DIN EN 62631-3-2 | Ω | >1012 |
| Comparative tracking index | IEC 60112 | 150 | |
| Dielectric strength | IEC 60243 | kV / mm | 35 |
| Dielectric constant @ 50Hz | DIN EN IEC 62631-2-1 | 4,9 | |
| Dielectric constant @ 1MHz | DIN EN IEC 62631-2-1 | 4,9 | |
| Dielectric dissipation factor (50 Hz) | DIN EN IEC 62631-2-1 | 0,04 | |
| Dielectric dissipation factor (1 MHz) | DIN EN IEC 62631-2-1 | 0,0007 |
